Item Capability Material:  FR4, FR4 Tg150, FR4 Tg170, CEM1, CEM3, Aluminum Base, Copper Base Min baord thickness 0.2mm Min board thickness for V-Scoring 0.4mm V-CUT board size 80-380mm Min trace width/space 0.08/0.08mm Min trace width/space 0.10/0.10mm Copper weight H OZ-6 OZ Min copper grid width/space 0.2/0.2mm Min space from copper to outline 0.2mm Min space from hole to copper 0.15mm 4-layer 0.18mm 6-layer 0.20mm 8-layer 0.23mm 10-layer or above Inner layer solder ring ≥0.12 4-layer or above Min baord thickness 0.2mm 2-layer 0.4mm 4-layer 0.6mm 6-layer 0.8mm 8-layer 1.0mm 10-layer or above Number of layer 1-24layer Min space form copper to grounded line 0.1mm Min plating slot hole size 0.45mm Min Non-plating slot holes 0.8mm Min hole size 0.2mm Hole copper weight 18um-35um Tolerance of PTH ±0.075mm Tolerance of NPTH ±0.05mm DIP Solder ring ≥0.18mm CLP solder ring 0.1mm Min space for mask bridge 0.1mm Min character height and width 0.8/0.15mm Min insulation resistance 1x10^12Ω （Normal） Peel strength ≤1.1N/mm E-test voltage 50-300V Warp and twist ≤0.075% Tolerance of alignment ±0.05mm Tolerance of outline ±0.13mm Max board size 400x600mm Impedance control ±10%OHM Via-in-pad 0.15mm Carbon ink √ Peelable mask √ ENIG+OSP BGA ENIG+OSP Castellated vias and edge plating Min hole castellated 0.5mm Countersink hole  ±0.2mm